BR/EDR and BLE dual-mode Bluetooth 5.0 wireless serial port transmission Bluetooth HLK-B50 master-slave integrated low-power bluetooth module HLK-B50 --EngrWorld

HLK-B50 is a produced by Hi-link Electronics. It supports both BR/EDR various devices with serial ports can use receiving data easily and quickly through this module.

By using the serial Bluetooth bidirectional transmission function of this module. They only need to connect the customer's device or MCU's serial port to this module, and the module will automatically complete the bidirectional data forwarding between the serial port . GATT and SPP can be connected simultaneously, which is like a bridge between the user's MCU serial port .

Supports AT commands, which can be used to query or set the basic parameters of the module, such as device name, serial port baud rate, etc. Supports Bluetooth BLE wireless configuration module parameters and OTA wireless upgrade module firmware;

This module provides rich testing tools and user documentation, including a mobile app demo, making it easy for users to quickly become familiar with and apply this module. The module has abundant on-chip resources and external pins, which can provide flexible and in-depth software and hardware customization development services tailored to the specific needs of customers.

Product characteristics

Built in 32-bit ARM Cortex M3 core, with a main frequency of up to 48MHz,
Fast serial port transmission, with a baud rate of up to 921600
Supports A2DP V1.3 and AVRCP V1.6, with built-in Audio CODEC
Built in lithium battery charging circuit, charging current can reach 200mA
Built in LDO, adjustable LDO output voltage
Built in Watchdog for reliable long-term operation
Wide working voltage of 2.6~4.2V, typical value of 3.3V
Rich output pins (UART, I2C, SPI, GPIO, ADC, PWM, I2S, etc.) can provide flexible and in-depth customized software and hardware development services

Application scenarios

At the same time, this module is equipped with a 32-bit ARM Cortex M3 core, as well as rich peripheral and interface resources, which can replace some microcontroller functions and directly serve as the main control, reducing costs and improving integration for customer products.

Common application scenarios are as follows:

Smart Home/Home Appliances

Control smart sockets, smart lights, smart door locks, etc. through mobile phones

Internet of Things

Wireless data transmission between mobile phones and devices, devices and devices

Instrumentation
Industrial and agricultural control

Health data monitoring, wireless care devices, etc

Automotive Electronics

Wireless detection and control, etc

Toy entertainment

More possibilities await you to unlock

	类型	描述
	产品类型	蓝牙模块
	制造商	Shenzhen Hi-Link
	厂牌	Hi-link
	封装/规格	SMT
	通讯协议	SPP V1.2 / HFP V1.8
	接口类型	UART/I2C/SPI/GPIO/ADC/PWM/I2S等
	发射功率	-20dBm ~ -10dBm 可调
	工作电压（Vin)	DC 2.6V-4.2V (典型 3.3V)
	工作电流	平均 <8mA (可调)
	接收灵敏度	-95dBm
	包装方式	卷带包装 (Tape & Reel)
	工作温度	-40℃ ~ +85℃
	长宽高	27x13x2mm

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